Every few years, a new electronic invention changes our lives. These devices and services rely on powerful data centers, which demand robust chips as well as high-speed interconnects and input/output (I/O). Accordingly, the printed circuit boards (PCBs) must be powerful and well-designed to provide quality solutions for power integrity, Signal integrity and EMC. Additionally, all connectors and electrical and optical cables connected to the PCB must provide a reliable environment for high-speed digital signals. To keep pace with big data, 5G and the Internet of Things, PCB/chip speed and reliability are paramount. To meet aggressive specifications, engineering teams need accurate simulations to validate and improve designs before they are taped out — and well before prototyping. Optimizing PCB reliability by studying three broad areas of product reliability — electrical, thermal and mechanical — to produce PCB designs that contribute to long service life and reduced product failure using ANSYS. One of the big challenges confronting product designers is electromagnetic interference, or EMI, Keep Emissions under limit with ANSYS Solution
ANSYS Full-wave analysis engine to design and simulate Next Generation 5G Antenna System with Industry Golden standard tool featuring Automated Precision, Automated Mesh, Automated Accuracy with the favor of Ansys Meshing algorithm a that Adaptively refines mesh throughout geometry
Application Expert at CADFEM INDIA
In-depth hands-on expertise in RF/Microwave test Instruments like Vector Network Analyzer, Signal Generator, Spectrum/Signal Analyzer, DSO, EMI/EMC Precompliance Tester. Deep insight knowledge on Wireless technologies / systems such as GSM, CDMA (WCDMA), LTE, LTE-A, 5G, RADAR, MIMO Phased Array Beamforming & Other communication systems
Topics to be discussed
Signal & Power Integrity of a 5G High Speed Board
Electro-Thermo-Mechanical reliability of a 5G Board
5G Mobile EMC and Regulations
5G Antenna Array and Beamforming
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